Financial Daily from THE HINDU group of publications
Friday, Apr 01, 2005
Financial Daily from THE HINDU group of publications Friday, Apr 01, 2005 |
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Info-Tech
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Alliances & Joint Ventures Wipro-Cadence pact Our Bureau
BANGALORE: Cadence Design Systems Inc said on Thursday that Wipro Technologies has renewed an agreement under which Cadence will provide Wipro access to its electronic design automation (EDA) technologies. Cadence also announced that Wipro taped out its largest design to date using its tool SoC Encounter. The latest agreement marks the third renewal of the Cadence-Wipro collaboration over the past eight years, with Cadence providing digital and analogue IC design, verification, silicon-package-board and design for manufacturing. The ongoing tie-up enhances Wipro's complex nanometer design capabilities. It provides Wipro with a strategic advantage in the semiconductor design industry, while supporting its design infrastructure across the 180-to-65-nanometer process nodes, said a Cadence press release.
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