Financial Daily from THE HINDU group of publications
Friday, Aug 05, 2005
Financial Daily from THE HINDU group of publications Friday, Aug 05, 2005 |
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Info-Tech
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Telecommunications Texas Instruments to launch single chip mobile phone solution in India Our Bureau
New Delhi , Aug. 4 World's first single chip mobile phone solution will be launched in India by US based Texas Instruments on Monday. The single chip phone solution will drastically bring down the cost and also increase the battery life of a mobile handset. This comes after Texas Instruments had announced last year its success in putting on the same slab of silicon, two disparate set of circuits: the digital audio portion that handles the voice capability; and the radio frequency or RF circuits that send the signal, to and fro, as radio waves. World's leading wireless chipmakers were known to be grappling with the complexity for three years now as a single chip was causing interference. Mr. Thomas J. Engibous, Chairman, Texas Instruments Incorporated, will also introduce world's first mobile phones based on the single chip solution in a function at New Delhi organised by the Cellular Operators Association of India (COAI). Texas Instruments has become part of the COAI as an associate. In India, Texas Instruments has pioneered semiconductor design over the last 20 years. It was among the first companies to start a state-of-the-art development centre in India. The Texas Instruments India centre has been instrumental in bringing the single chip mobile phone solution to the market. This key worldwide announcement to be made from India is an indicator of the possibilities ahead for all of us. This becomes even more relevant with the recent announcements by many global telecom players setting up their manufacturing units in India, said a COAI release. Earlier, Germany based chip manufacturer Infineon had also announced its single chip mobile platform the ULC chip platform aims to serve as a ’reference platform’ for new product designs, an indication that the production of sub-$20 mobile phones may begin in the first half of 2006. The new chip platform has condensed the current 150 to approximately 200 electric components needed in mobile phones today to just below 100 electric components. Infineon, which is also in talks with handset manufacturers, merged the processor and the send and receive electronics components, reducing the whole package to just one-third the size of current designs.
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