Business Daily from THE HINDU group of publications Monday, Jul 30, 2007 ePaper |
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Info-Tech
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Alliances & Joint Ventures Ericsson, TI in tie-up
Bangalore, July 29 Telecom equipment firm Ericsson and chipmaker Texas Instruments have entered into an engagement to develop mobile software platforms for 3G handsets. Handsets based on solutions developed from the collaboration will be available in the second half of 2008. The two companies will combine small and power efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAP applications processors from TI to create software. This will enable device manufacturers to o ffer advanced handsets for the high-end as well as the rapidly growing mid-range handset market. The solution will run on Open Operating Systems such as Windows Mobile, Linux and Symbian. The phones with these solutions support the GSM platform, so the solutions could support handsets in India. In short, such products could be used in India, but actual demand depends on the rollout of 3G networks in India, said the spokesperson. — Our Bureau
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