The Hindu Business Line : Tessolve expects $38 m funding by June

Bangalore, Feb. 19 Semiconductor company, Tessolve, which is putting up engineering, and assembly and testing facilities near Chennai, expects to go on stream by mid-October, Tessolve’sCo-Founder and Director, Mr V. Veerappan, told Business Line today.

Tessolve is present in India through two companies – Tessolve Services Pvt Ltd, which provides ’engineering’ services, and TAPP Semiconductors Pvt Ltd, which does ’assembly, testing, marking and packaging’ (ATMP) work.

It is TAPP Semiconductors that expects to get $38 million of private equity funding by June. It has already received $12 million from a venture capital fund, whose name has been kept confidential.

Mr Veerappan explained that the job that Tessolve Services does comes a step earlier in the process of semiconductor manufacture. The chain starts with the product concept developing into a design, which is the drawing up the complex circuits that go into the chip. The design is then fabricated, or etched on to extremely thin silicon wafers.

Before these wafers are mass produced, the samples have to be tested, because otherwise, should there be a defect the whole production would go waste. Tessolve Services intends to provide this testing service.

Further, after the wafers mass produced, there is a long process called ATMP, where the wafers are cut into units, provided leads and packed, and made ready to be put into devices such as cell phones. Again, first a few samples are tested before the whole lot is assembled, marked and packed. This testing service is also provided by Tessolve.

Tessolve will also do failure analysis when there is a defect. Tessolve Services has secured $10 m of funding and does not expect to need more for now.

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Tessolve expects $38 m funding by June

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