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Texas Instruments unveils single-chip mobile solution

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Mr Thomas J. Engibous, Chairman, Texas Instruments, with Dr J.S. Sarma, Secretary, DoT and Chairman, Telecom Commission, releasing the single-chip mobile phone solution in the Capital on Monday. Kamal Narang
Mr Thomas J. Engibous, Chairman, Texas Instruments, with Dr J.S. Sarma, Secretary, DoT and Chairman, Telecom Commission, releasing the single-chip mobile phone solution in the Capital on Monday. Kamal Narang

Our Bureau

New Delhi, Aug. 8

TEXAS Instruments (TI) has announced the global launch of its single-chip mobile solution in India.

Designed and developed at TI's Bangalore development centre, manufacturers such as Nokia, Motorola, and Ericsson are expected to launch handsets based on the single-chip solution in nine months.

Announcing the launch, Mr Tom Engibous, Chairman, said: "The single-chip solution will bring down power and space consumption by 50 per cent and cut costs by 30 per cent. This solution is specifically designed for India, which is a booming telecom market."

Last year, TI had announced its success in putting on the same slab of silicon two disparate set of circuits: the digital audio portion that handles the voice capability and the radio frequency or RF circuits that send the signal, to and fro, as radio waves.

TI has also become part of the Cellular Operators Association of India as an associate.

Mr T.V. Ramachandran, Director-General of COAI, said: "The solution will help in realising the dream of a Rs 1,000 mobile, which will boost cellular penetration and help achieve the target of 250 million phones by December 2007."

Addressing a technology seminar organised by the COAI, Mr Engibous also announced the first cell-phones built entirely in India, from concept and design to production. "Based on TI's TCS chipset family, the GSM/GPRS handsets have been developed by Indian companies BPL and Quasar for UK firm Primus," Mr Engibous said.

These handsets include TI's single-chip Bluetooth module and other TI components, including audio amplifier, voltage regulators, and standard logic components.

"These designs will serve as platforms for development of a variety of handsets for different market segments, from ultra-low-cost to mid-range voice- and feature-rich data-centric handsets. The first phones based on the TI and BPL co-operation will be available in September 2005," he added.

The announcement is part of the Emerging Markets Initiative launched by the GSM Association earlier this year.

This initiative has already seen Motorola coming out with a series of ultra low-cost handsets designed to deliver value to the consumers without compromising on features.

Dr J.S. Sarma, Chairman of the Telecom Commission, welcomed TI's efforts and expressed the hope that more such announcements would be made by the company in the future.

Mr Anil Nayar, Chairman of COAI, said that it was crucial for the industry to have low-cost connectivity solutions.

He added that TI's development of a single chipset solution would go a long way in lowering the entry barrier and improving affordability.

(This article was published in the Business Line print edition dated August 9, 2005)
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