EEPC, Malaysian trade body ink MoU

Our Bureau Chennai | Updated on March 15, 2019

EEPC India and the Malaysian Automotive, Robotics and IOT Institute (MARii) has signed an MoU to recommend investment in robotics, automotives and related areas and to encourage and identify companies from their respective countries for joint ventures. The MoU signed at the eighth edition of International Engineering Sourcing Show (IESS VIII) held in Chennai is also aimed at taking manufacturing to the next level of automation through robotics, artificial intelligence, machine learning and Internet of Things. “The prestigious industry and trade bodies of the two countries would facilitate joint efforts for technology development and adoption,” said Dato Madani Sahari, CEO, MARii.

Published on March 15, 2019

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