Financial Daily from THE HINDU group of publications
Thursday, Apr 22, 2004

News
Features
Stocks
Cross Currency
Shipping
Archives
Google

Group Sites

Info-Tech - Hardware


Flextronics invests $10 m in inSilica

Our Bureau


Mr Ash Bharadwaj, President, ODM Products Group, Flextronics (left); Mr Anant Agrawal, CEO, InSilica; and Mr Duncan Robertson, Senior Vice-President, Design Services, Flextronics; at a press conference in Bangalore on Wednesday. - - G. R. N. Somashekar

Bangalore , April 21

ELECTRONICS manufacturing services firm Flextronics said on Wednesday that it has invested $10 million in inSilica Inc, a fabless semiconductor design company, in the second round funding. A fabless semiconductor company such as inSilica does the designing of chips but farms out the actual manufacturing.

Flextronics also said that it had expanded its silicon development capabilities by selecting inSilica as its system-on-a-chip development partner. System-on-a-chip (SoC) technology is the packaging of all necessary electronic circuits and parts for a system such as cell phone or digital camera, on a single integrated circuit (IC), generally known as a microchip.

As part of the tie-up, inSilica will provide its designing services to Flextronics and its OEM (original equipment manufacturer) partners, said Mr Anant Agrawal, President and CEO, inSilica.

"With this latest funding, the company has raised a total of $20 million till date," Mr Agrawal said. inSilica had raised $10 million from NewPath Ventures last year.

Flextronics is outsourcing its silicon design services to India for the first time. "In addition to meeting our goal to expand our existing SoC solutions, we chose inSilica as our SoC partner because of its world class design capabilities, growing portfolio and access to cost effective resource in Bangalore," said Mr Ash Bharadwaj, President, Flextronics, ODM Products Group.

"We look forward to utilising their expertise in mixed signal and radio frequency design, large scale integration and advanced process technologies," he added.

InSilica has a chip-design centre in Bangalore with nearly 50 engineers. The company, which started last year, has revenues in the range of $10-$15 million.

"We are targeting a revenue of $100 million over next three years," Mr Agrawal said adding that the company expected to add about 150 engineers to its chip design team by next year-end.

More Stories on : Hardware

Article E-Mail :: Comment :: Syndication :: Printer Friendly Page



Stories in this Section
Cranes Soft share redemption


US chamber clears outsourcing `myths'
Outsourcing issue being politicised: US Ambassador
IBM at work on improving Bharti Tele billing system
Mobile operators to send SMS asking people to vote
Flextronics invests $10 m in inSilica
PI Corp, Aditi Tech to develop next gen Linux product
HCL Info Q3 net at Rs 36.3 cr — Third interim dividend at 60%
iGate Global opens Hyderabad centre
Patni plans for Mumbai centre
Correction
`Attrition, absenteeism bug BPO cos'
Cisco to enable networks to handle security threats
Anyuser Tele offers call to US, UK at Rs 2.35 per minute



The Hindu Group: Home | About Us | Copyright | Archives | Contacts | Subscription
Group Sites: The Hindu | Business Line | Sportstar | Frontline | The Hindu eBooks | The Hindu Images | Home |

Copyright © 2004, The Hindu Business Line. Republication or redissemination of the contents of this screen are expressly prohibited without the written consent of The Hindu Business Line