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Freescale joins IBM Alliance

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Bangalore Jan. 25 Chipmaker Freescale announced a collaboration with the Big Blue for future semiconductor research. Freescale announced it has joined the IBM Alliance and will jointly conduct research and development in the semiconductor domain. This initiative will be a step towards transitioning to 45nm chips.

This alliance will enable Freescale to further strengthen its manufacturing strategy. Freescale will now have access to the combined manufacturing capacity of IBM's Common Platform partners.

The agreement includes work on Complementary Metal Oxide Semiconductor and Silicon-on-Insulator, as well as advanced research and design. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.

"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Ms Lisa Su, Vice President of Semiconductor Research and Development, IBM, adding, "Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless."

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